COMPOSITES 2023

Structural design and mechanical performance analysis of a full-scale 3D-printed bridge deck using GENOA 3DP Virtual Simulation Tool

  • Stepinac, Lucija (University of Zagreb, Faculty of Architecture)
  • Cantarutti, Andrea (AlphaSTAR)
  • Baid, Harsh (AlphaSTAR)
  • Galić , Josip (University of Zagreb)

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Replacing traditional materials and building processes of architectural structures with modern materials and technological production processes are necessary to increase sustainability. In the production of the 3D-printed component, the focus is on less material waste, energy consumption and gas emissions from the machines. The complexity of defining the properties of large-scale 3D printed objects lies in the large number of factors that can affect the quality: Print path, layer height, material of the substrate on which the element is printed, quality of the support material (if required), prediction of the temperature transition of the layers within the print, formation of micro and macro cracks, definition of the print speed, ambient temperature, heating/cooling of the surrounding space, retraction, retention of material due to the air passage of the tool, etc. The digital engineering approach adds value to additive manufacturing by creating temperature-dependent material models, simulating tool paths for 3D printing, predicting micro- and macrocracks, and element failure. A desirable strength-to-weight ratio for architectural structures is a factor that must be considered during design. The mathematically controlled implicit function of Triply Periodic Minimal Surface (TPMS) has improved mechanical properties compared to other lattice structures. Virtual simulation and progressive failure of the lightened polymeric TPMS bridge deck with dimensions of 2.7 x 1.0 x 0.2 m was performed in GENOA 3DP software. The results of detailed material classification and virtual simulations of 3D printed parts are optimistically introducing additive manufacture in construction engineering on a larger scale.